MIRTEC to Present Complete Line of Advanced 3D AOI and SPI Inspection Systems in Exclusive ONLINE CONFERENCE & EXPO
June 2020 – MIRTEC,
‘The Global Leader in Inspection Technology,’ is excited to announce its
participation in an exclusive ONLINE CONFERENCE & EXPO. The event will be
broadcast live on Wednesday, July 8, 2020 from 10 a.m. – 2:30 p.m. EST and will
include a full program of live presentations, interviews and special guests.
Sponsored
by Global SMT & Packaging, the ONLINE CONFERENCE & EXPO will feature
the latest technical presentations, video booth interviews and new products
from eight exhibitors. To learn more or to register as a visitor, visit https://app.greenrope.com/users/myteam45084/Media653.html.
“We are looking forward to participating in this exclusive ONLINE EXPO,”
stated Brian D’Amico, President of MIRTEC’s North American Sales and Service
Division. “MIRTEC will feature video feed and information about our award-winning
inspection solutions specifically designed to address the full spectrum of inspection
requirements associated with the Electronics Manufacturing Industry.”
The
MV-6 OMNI 3D AOI Machine is
configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology
which combines our 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s
revolutionary Digital Tri-Frequency Moiré 3D system in a cost-effective platform.
MIRTEC’s
15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed
and manufactured by MIRTEC for use with our complete product range of 3D
inspection systems. MIRTEC’s Digital Tri-Frequency Moiré
Technology, provides true 3D inspection using a total of four (4) Programmable
Digital Moiré Projectors to yield precise height measurement data used to
detect lifted component and lifted lead defects as well as solder volume post
reflow. Fully
configured the MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel
Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology has set the standard by
which all other inspection equipment is measured.
MIRTEC’s MV-3 OMNI Desktop 3D AOI Machine is configured
with the same hardware and software as MIRTEC’s in-line OMNI-VISION® 3D Inspection Systems
providing 100 percent compatibility across MIRTEC’s entire 3D AOI product line. These systems feature
MIRTEC’s
exclusive OMNI-VISION® 3D Inspection Technology which combines our 15
Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Tri-Frequency
Quad Moiré 3D system in a newly designed desktop platform. MIRTEC’s 15
Mega Pixel CoaXPress Vision System is a proprietary camera system designed and
manufactured by MIRTEC for use with our complete product range of 3D inspection
systems. MIRTEC’s Digital Multi-Frequency Quad Moiré
Technology, provides true 3D inspection using a total of four (4) Programmable
Digital Moiré Projectors to yield precise height measurement data used to detect
lifted component and lifted lead defects as well as solder volume post reflow. Fully
configured the new MIRTEC MV-3 OMNI machine features four (4) 10 Mega Pixel
Side-View Cameras in addition to the 15 Mega Pixel CoaXPress Top-Down Camera. Without
question, the MV-3 OMNI is the most Technologically Advanced Desktop 3D AOI machine
in the world!
MIRTEC’s MS-11e 3D SPI Machine is configured with an exclusive 15 Mega Pixel CoaXPress Camera System,
providing enhanced
image quality, superior accuracy and incredibly fast inspection rates.
The MS-11e
uses Dual Projection Shadow Free
Moiré Phase Shift Imaging, excessive Technology to inspect solder paste
depositions on PCBs post screen print for insufficient solder, shape deformity,
shift of deposition and bridging. The
MS-11e uses the same robust platform as MIRTEC’s MV-6 OMNI Series.
Smart
Inspection Software using AI based on Deep Learning Methodology
MIRTEC’s
Automatic Programming Software uses Artificial intelligence
based Deep Learning Methodology
to minimize human error and standardize the programming process. This advanced
software solution automatically analyzes the PCB architecture and assigns the
appropriate part type and process parameters for each SMT device thereby
maximizing programming efficiency. Only
basic operator training is required to achieve optimal inspection results.
MIRTEC’s
‘Best-in-Class’ Optical Character Recognition (OCR) Technology reduces false
calls and improves production process efficiency by automatically restoring and
inspecting damaged characters through AI and Deep Learning.
Leading
the Way to Industry 4.0
MIRTEC’s Total Remote Management System
(TRMS) is a fully integrated Industry 4.0 Solution which combines remote
management with real-time data monitoring and analysis for each system within
the SMT production line. MIRTEC’s TRMS
provides real-time remote monitoring of status information and
statistical data such as; equipment operation status, production yield, PC
resources, temperature, humidity, etc.
The combination of MIRTEC’s 3D AOI and TRMS systems
provide a vast improvement in production process management over common AOI
technologies and management software. The TRMS Module is a
key part of MIRTEC’s Intelligent Factory Automation System, INTELLISYS®. This powerful software suite was designed and developed
by MIRTEC to provide manufacturers with a clear view into the manufacturing
process, thereby helping them achieve higher operating efficiencies and
improved quality.
“MIRTEC continues to set new standards within the highly
competitive Electronics Inspection Industry”, continued D’Amico. “These revolutionary products provide unprecedented
3D inspection performance and the industry’s lowest cost of ownership making
them an ideal solution for electronics manufacturing companies of all sizes. We look forward to welcoming visitors
to our booth #1900during the three-day
event.”
MIRTEC is a
leading global supplier of automated inspection systems to the electronics
manufacturing industry. For further
information, please visit www.mirtec.com
